Chipping In DNA pattern

By K. Prafull As chip makers keep giving up faster and more energy efficient chips, industry observes have on doubt that they will hit a brick wall a decade or so later. Even if they do not, it is becoming difficult to increase the speed of silicon chips, while keeping them energy efficient. Several alternative have been proposed to silicon, but none of them are compatible with today's manufacturing techniques. Now, IBM and the California Institute of Technology in the US have jointly developed a better alternative - a process using the DNA as a model. The DNA is used is as a scaffolding to assemble millions of very small particles extremely close together and in precise patterns. Making chips with components closer together helps make smaller devices and faster computers. Current semiconductor fabrication methods cannot place components of chips closer than 22 nanometres. But the IBM-CalTach team has managed to place particle as close as 6 nanometres. Nevertheless, the technique cannot be used to make chips right away. The dissipation of heat, as components get tinier and tinier, is a concern. Also, the technology could take 10 years to come to the market. (Businessworld)